Diamond Saw Blades | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
The diamond saw blade of a machine tool needs to be manufactured with high precision. Otherwise, it causes excessive tolerance stack-up in the object finished by the diamond saw blade. Hortech employs ultra-fast laser, precision motion platform, and visual calibration to cut the diamond at the micron level. This could cut the diamond cone that fits its carrier. Hortech Co. is a high-quality Diamond Saw Blades, Employ ultrafast lasers to cut diamonds on diamond saw blades manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Diamond Saw Blades
Diamond Cutting Tools, Diamond Cutting
The diamond saw blade of a machine tool needs to be manufactured with high precision. Otherwise, it causes excessive tolerance stack-up in the object finished by the diamond saw blade. Hortech employs ultra-fast laser, precision motion platform, and visual calibration to cut the diamond at the micron level. This could cut the diamond cone that fits its carrier.
Laser Micro-Cut or Repaired Diamond Saw Blades
Hortech employs ultra-fast laser to cut the diamond on the diamond blade, or repair the worn blade for reuse and cost reduction.
Product Features
- Diamond laser micro-cutting.
- Non-contact laser finishing without wearing.
- Ultra-fast, high-precision laser finishing that does not generate thermal effects.
Applications
- Grinders.
- Cutters.
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Diamond Saw Blades | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Diamond Saw Blades, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.