Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Wafer Fabrication & Semiconductor Packaging | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Advanced micron electromechanical packaging for back-end semiconductor process. The precision of the semiconductor front-end process is at the nanometer level, so it belongs to the nanoelectromechanical field. Hortech specializes in micron precision, which is ahead of the advanced packaging industry. The latter focuses on precision at the micron level. Hortech Co. is a high-quality Wafer Fabrication & Semiconductor Packaging, Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling manufacturer from Taiwan since 2006. With more than 27 years experience, Hortech Co. is professional provider of laser equipment and OEM solutions.

Advanced micron electromechanical packaging for back-end semiconductor process | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

The precision of advanced packaging / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

The precision of advanced packaging

Wafer Fabrication & Semiconductor Packaging

Advanced micron electromechanical packaging for back-end semiconductor process

The precision of the semiconductor front-end process is at the nanometer level, so it belongs to the nanoelectromechanical field. Hortech specializes in micron precision, which is ahead of the advanced packaging industry. The latter focuses on precision at the micron level.

Wafer Fabrication & Semiconductor Packaging

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Result 1 - 12 of 14
Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes - Hortech Hortech performs laser micro-drilling to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm.
Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes

Hortech employs the waterjet laser machine to produce both microvias and micro blind holes...

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Micro-cut Complex Ceramic Ajinomoto Build-up Film (ABF) PCB by Waterjet Laser Machine - Hortech performs laser micro-cutting to cut the complex ceramic ABF PCB by the waterjet laser machine. The precision of the cutting is < +/- 3-7 %
Micro-cut Complex Ceramic Ajinomoto Build-up Film (ABF) PCB by Waterjet Laser Machine

Hortech performs laser micro-cutting to cut the complex ceramic ABF PCB using the waterjet...

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Laser Drilled Microvia on Complex Ceramic Ajinomoto Build-up Film (ABF) PCB by Waterjet Laser Machine - Hortech performs laser micro-drilling to produce microvia patterns on the complex ceramic ABF PCB by the waterjet laser machine. Both through and blind vias can be produced. The diameters of microvias the pictures demonstrate include 250 um, 300 um, and 500 um.
Laser Drilled Microvia on Complex Ceramic Ajinomoto Build-up Film (ABF) PCB by Waterjet Laser Machine

Hortech performs laser micro-drilling to produce both through and blind vias on the complex...

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Precision cut silicon carbide (SiC) wafer by the waterjet laser machine - Hortech uses its waterjet laser machine to cut the silicon carbide (SiC) wafer. The edges are flat and smooth. There is no thermal effect and heat.
Precision cut silicon carbide (SiC) wafer by the waterjet laser machine

Hortech performs laser cutting to cut the silicon carbide (SiC) wafer using its waterjet laser...

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Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine - Hortech uses its waterjet laser machine to cut the silicon wafer and create microtexture/microstructure.
Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine

Hortech creates microtexture/microstructure on the silicon wafer by using its waterjet laser...

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Silicon Wafer Dicing by the Waterjet Laser Machine - Hortech employs the waterjet laser machine to perform Si wafer dicing.
Silicon Wafer Dicing by the Waterjet Laser Machine

Hortech works with a Swiss manufacturer to launch the waterjet laser machine, which can perform...

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Silicon carbide (SiC) Wafer Dicing - SiC wafer laser dicing
Silicon carbide (SiC) Wafer Dicing

Hortech has developed the ultrafast laser machine that can implement SiC wafer dicing at high...

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Laser Engraved Wafer ID - Wafer identifiers engraved by the laser
Laser Engraved Wafer ID

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Wafer Laser Micro-engraving - Employ the laser to engrave SEMI fonts in the precise position on the wafer
Wafer Laser Micro-engraving

Before processing semiconductor wafers, it is necessary to precisely engrave the SEMI OCR fonts...

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Laser Micro-cutting Small Wafers - The wafer in the traditional size is laser cut into smaller pieces as a minifab’s process requires.
Laser Micro-cutting Small Wafers

The surface of the wafer must be clean and dust-free after the larger one is cut, so it is crucial...

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Laser Heterotypic Cutting on Silicon Wafer - Cutting silicon wafers and pattern production for mechanical components
Laser Heterotypic Cutting on Silicon Wafer

Silicon wafers have been widely adopted, so many semiconductor-related industries prefer to use these...

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Laser Micro-cutting Fingerprint IC Substrates - Cutting on IC substrates composed of composite materials
Laser Micro-cutting Fingerprint IC Substrates

To cut fingerprint IC substrates, Hortech coats substrates with protective films to reduce...

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Result 1 - 12 of 14

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Wafer Fabrication & Semiconductor Packaging | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Wafer Fabrication & Semiconductor Packaging, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.