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Silicon Wafer Dicing by the Waterjet Laser Machine | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Hortech works with a Swiss manufacturer to launch the waterjet laser machine, which can perform wafer dicing. The pictures demonstrates Silicon wafer dicing. Its thickness is 650 um. Hortech Co. is a high-quality Silicon Wafer Dicing by the Waterjet Laser Machine, Hortech employs the waterjet laser machine to perform Si wafer dicing. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Wafer dicing, wafer cutting, waterjet laser machine / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Hortech employs the waterjet laser machine to perform Si wafer dicing. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Silicon Wafer Dicing by the Waterjet Laser Machine - Hortech employs the waterjet laser machine to perform Si wafer dicing.
  • Silicon Wafer Dicing by the Waterjet Laser Machine - Hortech employs the waterjet laser machine to perform Si wafer dicing.

Silicon Wafer Dicing by the Waterjet Laser Machine

Wafer dicing, wafer cutting, waterjet laser machine

Hortech works with a Swiss manufacturer to launch the waterjet laser machine, which can perform wafer dicing. The pictures demonstrates Silicon wafer dicing. Its thickness is 650 um.

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Silicon Wafer Dicing by the Waterjet Laser Machine | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Silicon Wafer Dicing by the Waterjet Laser Machine, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.