Laser cutting, laser drilling, thick metal, wafer dicing, diamond cutting | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Waterjet cutting and drilling machine that performs cold, heat-free processing. It can process thick metal with high aspect-ratio. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Waterjet cutting and drilling machine that performs cold, heat-free processing. It can process thick metal with high aspect-ratio.

Waterjet Laser Cutting and Drilling Machines

Laser cutting, laser drilling, thick metal, wafer dicing, diamond cutting

This waterjet laser cutting and drilling machine features high aspect ratio, and heat-free, cold processing. It can drill and cut thick metal, forming highly vertical edges or deep holes.


Waterjet Laser Cutting and Drilling Machines

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Waterjet Laser Cutting and Drilling System - Waterjet Laser CNC Micro-cutting & Micro-drilling System
Waterjet Laser Cutting and Drilling System

Hortech is pleased to announce a new collaboration with an European manufacturer. Together...

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Waterjet Diamond Cutting System - Waterjet Diamond Cutting Machine
Waterjet Diamond Cutting System

This 3-axis system allows you to cut both natural and laboratory grown diamonds (CVD, HPHT)...

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Result 1 - 2 of 2

Waterjet Laser Cutting and Drilling Machines | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Waterjet Laser Cutting and Drilling Machines, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.