Waterjet Diamond Cutting System | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
This 3-axis system allows you to cut both natural and laboratory grown diamonds (CVD, HPHT) in small and medium size. You may cut rough diamonds in a single setting. It can perform sawing, coring, and slicing without blackening and opening. The processes are fast and easy with minimal weight loss. The risk of breakage is low. Only trivial post treatment is required. Hortech Co. is a high-quality Waterjet Diamond Cutting System, Waterjet Diamond Cutting Machine manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Waterjet Diamond Cutting System
Diamond cutting, 3-axis system
This 3-axis system allows you to cut both natural and laboratory grown diamonds (CVD, HPHT) in small and medium size. You may cut rough diamonds in a single setting. It can perform sawing, coring, and slicing without blackening and opening. The processes are fast and easy with minimal weight loss. The risk of breakage is low. Only trivial post treatment is required.
Specification:
Working volume (W*D*H): 150*150*100 mm
Accuracy: +/- 5 um
Repeatability: +/- 2 um
Number of axes: 3-axis
Laser type: Diode pumped solid state Nd: YAG, pulsed
Wavelength: 532 nm
Features:
Smooth surface & sharp edges
Cylindrical beam resulting in excellent parallel kerfs (no V-shape)
No heat/thermal effects
Stable high-volume production
Download Hot Products
Waterjet Diamond Cutting System | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Waterjet Diamond Cutting System, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.