Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Hortech creates microtexture/microstructure on the silicon wafer by using its waterjet laser machine to perform precision laser cutting. The thickness of this silicon wafer is 650 um. The width of the groove is approximately 200 um. The depth of the groove is approximately 200 um. Hortech Co. is a high-quality Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine, Hortech uses its waterjet laser machine to cut the silicon wafer and create microtexture/microstructure. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine
Wafer microtexturization, wafer microstructurization, wafer dicing, laser micro-cutting, waterjet laser machine
Hortech creates microtexture/microstructure on the silicon wafer by using its waterjet laser machine to perform precision laser cutting. The thickness of this silicon wafer is 650 um. The width of the groove is approximately 200 um. The depth of the groove is approximately 200 um.
Download Hot Products
Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Microtexturized/microstructurized silicon (Si) wafer by the waterjet laser machine, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.