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Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Hortech employs the waterjet laser machine to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm. Hortech Co. is a high-quality Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes, Hortech Hortech performs laser micro-drilling to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Germanium (Ge) wafer, laser micro-drilling, microvias, blind holes, waterjet laser machine / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Hortech Hortech performs laser micro-drilling to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes - Hortech Hortech performs laser micro-drilling to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm.
  • Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes - Hortech Hortech performs laser micro-drilling to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm.

Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes

Germanium (Ge) wafer, laser micro-drilling, microvias, blind holes, waterjet laser machine

Hortech employs the waterjet laser machine to produce both microvias and micro blind holes on Germanium (Ge) wafer. The diameters are 200 µm.

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Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Micro-drilling on Germanium (Ge) Wafer by Waterjet Laser Machine for Microvias and Micro Blind Holes, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.