Silicon carbide (SiC) Wafer Dicing | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Hortech has developed the ultrafast laser machine that can implement SiC wafer dicing at high speed. The precision of its XY motion platform is at < +/- 1 um. This machine can cut SiC wafers stably. We provide both OEM services and machines for sale. You may request us to help you cut SiC wafers in different sizes and thicknesses. You may also purchase this machine if high-volume SiC wafer dicing is needed. Hortech Co. is a high-quality Silicon carbide (SiC) Wafer Dicing, SiC wafer laser dicing manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Silicon carbide (SiC) Wafer Dicing
Silicon carbide (SiC) wafer cutting, laser micro-cutting, wafer dicing, ultrafast laser, silicon carbide wafer, IGBT cutting, GaN, GaAs, chemical compound semiconductor, waterjet laser machine
Hortech has developed the ultrafast laser machine that can implement SiC wafer dicing at high speed. The precision of its XY motion platform is at < +/- 1 um. This machine can cut SiC wafers stably. We provide both OEM services and machines for sale. You may request us to help you cut SiC wafers in different sizes and thicknesses. You may also purchase this machine if high-volume SiC wafer dicing is needed.
Hortech can also perform wafer dicing for SiC, GaAs, and other materials.
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Silicon carbide (SiC) Wafer Dicing | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Silicon carbide (SiC) Wafer Dicing, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.