Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Ultrafast SiC Wafer Dicing Laser Machine | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Hortech has successfully developed the precision laser machine that can dice SiC wafers at high speed. The precision of its XY motion platform is < +/- 1 um. You may order this machine if you have stable, high-volume needs for SiC wafer dicing. You may provide us with detailed information regarding your needs, including the precision you desire, the size of your SiC wafers. Hortech will custom design and install the machine for you. Hortech Co. is a high-quality Ultrafast SiC Wafer Dicing Laser Machine, Ultrafast SiC wafer laser dicing machine manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Silicon carbide wafer, wafer dicing, laser micro-cutting, precision wafer dicing machine, SiC wafer / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Ultrafast SiC wafer laser dicing machine / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Ultrafast SiC Wafer Dicing Laser Machine - Ultrafast SiC wafer laser dicing machine

    Ultrafast SiC Wafer Dicing Laser Machine

    Silicon carbide wafer, wafer dicing, laser micro-cutting, precision wafer dicing machine, SiC wafer

    Hortech has successfully developed the precision laser machine that can dice SiC wafers at high speed. The precision of its XY motion platform is < +/- 1 um. You may order this machine if you have stable, high-volume needs for SiC wafer dicing. You may provide us with detailed information regarding your needs, including the precision you desire, the size of your SiC wafers. Hortech will custom design and install the machine for you.

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    Ultrafast SiC Wafer Dicing Laser Machine | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

    Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Ultrafast SiC Wafer Dicing Laser Machine, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

    Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

    Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.