Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Hortech Co. high-quality Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling, laser micro-perforation manufacturer from Taiwan | Hortech Company

Hortech Co. is a high-quality Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling, laser micro-perforation manufacturer from Taiwan since 2006. Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Company

Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

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Result 1 - 12 of 100
Stainless Steel Drum Scales for Robotics - Hortech's laser processing services for precision metrology and optical tooling
Stainless Steel Drum Scales for Robotics

Hortech manufactures scales for different types of optical encoders, including linear, angular,...

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Stainless Steel Linear Scales/Rulers for Optical Encoders - Linear Scales for optical encoders that provide position feedback for motion control
Stainless Steel Linear Scales/Rulers for Optical Encoders

The length of the linear scale is: < 300 mm +/- 5 µm. The accuracy is: +/- 0.5 µm. Linear...

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Stainless Steel Disc Scales for Optical Encoders - The cutting precision is <+/-20 µm. Hortech can produce disc scales for your absolute & Incremental encoders. Just provide us with your specifications.
Stainless Steel Disc Scales for Optical Encoders

The cutting precision is <+/-20 µm. Hortech can produce disc scales for your absolute & Incremental...

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Laser micro-cut & micro-drilled thin films - Hortech employs the DUV laser to perform micro-cutting. It is a cold process that can precisely locate and cut thin films without dust and trimmings. As well, the process does not produce thermal effects. The outcome achieves high precision.
Laser micro-cut & micro-drilled thin films

Thin films encompass metal materials and organic materials. Their thickness is between monoatom/single...

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Ultrafast DUV Laser with Large Power - Laser micro-etched circuits on polycarbonate thin films - Circuits on polycarbonate thin films by DUV laser micro-etching
Ultrafast DUV Laser with Large Power - Laser micro-etched circuits on polycarbonate thin films

Hortech has successfully employed the DUV laser to produce circuits on polycarbonate thin films....

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Ultrafast DUV Laser with Large Power - MicoLED Lift-off - Lift off MicroLED thin films with circuits from sapphire substrates. Employ the DUV laser to irradiate the part adhered to the sapphire
Ultrafast DUV Laser with Large Power - MicoLED Lift-off

The laser can be employed to fabricate microLEDs. This includes: (1) transfer and mount on sapphire...

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Ultrafast DUV Laser with Large Power - Semicut Polymer - Employ DUV laser to control the depth of cutting functional materials or multilayered films. You may design the layers you want to cut through. DUV laser allows for semi-cut.
Ultrafast DUV Laser with Large Power - Semicut Polymer

Semi-cutting films is often required when it comes to processing multi-layered materials. Performing...

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Ultrafast DUV Laser with Large Power - Cutting Multi-layered Composites - Hortech employs the DUV laser to cut multi-layered composites.
Ultrafast DUV Laser with Large Power - Cutting Multi-layered Composites

Hortech exploits how different materials absorb the DUV laser to cut gradually until reaching...

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Ultrafast DUV Laser with Large Power - Thin Wafer-dicing - Hortech employs the DUV laser to cut thin wafers, resulting in low stress and low thermal effects
Ultrafast DUV Laser with Large Power - Thin Wafer-dicing

The laser with DUV wavelength can gasify and lift off the material by extremely high photon...

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Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer - Employ the DUV laser to cut thick silicon wafers with high crystal density, resulting in narrow grooves. The wafers do not suffer from the damages caused by the stress.
Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer

Employing conventional processes to dice thick silicon wafers, including direct laser cutting...

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Electron Beam Mo Devices with Micro-holes - Laser micro-drilled Mo parts for electron microscopes
Electron Beam Mo Devices with Micro-holes

Hortech implements laser micro-drilling on electron beams Mo devices (thickness = 50 µm)....

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Precision Laser Micro-etching - Hortech precisely calibrates parameters to employ laser micro-etching on double sided ITO thin film glass sensors
Precision Laser Micro-etching

Hortech's laser micro-etching can achieve the precision at micron level. It is employed to remove...

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Result 1 - 12 of 100

Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.