Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Ultrafast DUV Laser with Large Power - Semicut Polymer | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Semi-cutting films is often required when it comes to processing multi-layered materials. Performing semi-cut to cut through designated layers enables lift-off or adhering. Designing, integrating, and optimizing mechatronic platforms, focused optics, and controlling techniques is required to perform semi-cut and cutting-through. Hortech Co. is a high-quality Ultrafast DUV Laser with Large Power - Semicut Polymer, Employ DUV laser to control the depth of cutting functional materials or multilayered films. You may design the layers you want to cut through. DUV laser allows for semi-cut. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Perform semi-cut on functional polymer on flexible circuit boards or multi-layered composites to the designated depth / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Employ DUV laser to control the depth of cutting functional materials or multilayered films. You may design the layers you want to cut through. DUV laser allows for semi-cut. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Ultrafast DUV Laser with Large Power - Semicut Polymer - Employ DUV laser to control the depth of cutting functional materials or multilayered films. You may design the layers you want to cut through. DUV laser allows for semi-cut.
  • Ultrafast DUV Laser with Large Power - Semicut Polymer - Employ DUV laser to control the depth of cutting functional materials or multilayered films. You may design the layers you want to cut through. DUV laser allows for semi-cut.

Ultrafast DUV Laser with Large Power - Semicut Polymer

Perform semi-cut on functional polymer on flexible circuit boards or multi-layered composites to the designated depth

Semi-cutting films is often required when it comes to processing multi-layered materials. Performing semi-cut to cut through designated layers enables lift-off or adhering. Designing, integrating, and optimizing mechatronic platforms, focused optics, and controlling techniques is required to perform semi-cut and cutting-through.

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Ultrafast DUV Laser with Large Power - Semicut Polymer | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Ultrafast DUV Laser with Large Power - Semicut Polymer, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.