Ultrafast DUV Laser with Large Power - MicoLED Lift-off | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
The laser can be employed to fabricate microLEDs. This includes: (1) transfer and mount on sapphire plates; (2) employ the high-precision laser to micro-cut crystals; and (3) employ the DUV laser to lift off crystals on panels for mass transfer. Hortech’s ultrafast DUV laser machine helps the above processes to achieve high yield rates. You may employ the laser to fabricate microLED panels and circuit boards, including laser micro-etching, micro-drilling, or micro-cutting. Hortech Co. is a high-quality Ultrafast DUV Laser with Large Power - MicoLED Lift-off, Lift off MicroLED thin films with circuits from sapphire substrates. Employ the DUV laser to irradiate the part adhered to the sapphire manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Ultrafast DUV Laser with Large Power - MicoLED Lift-off
Hortech employs the DUV wavelength to lift off the adhesive and separate the upper and bottom layers. This allows the carrier at the bottom layer to fall off.
The laser can be employed to fabricate microLEDs. This includes: (1) transfer and mount on sapphire plates; (2) employ the high-precision laser to micro-cut crystals; and (3) employ the DUV laser to lift off crystals on panels for mass transfer. Hortech’s ultrafast DUV laser machine helps the above processes to achieve high yield rates. You may employ the laser to fabricate microLED panels and circuit boards, including laser micro-etching, micro-drilling, or micro-cutting.
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Ultrafast DUV Laser with Large Power - MicoLED Lift-off | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Ultrafast DUV Laser with Large Power - MicoLED Lift-off, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.