Deep Ultraviolet Laser Machine with Large Power for Wafer-dicing | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
This laser machine employs DUV ultrashort pulses to remove the protective films or liquid of composites without damaging the silicon wafer at the bottom. It then performs plasma vertical wafer-dicing that results in smooth edges. It can also cut or dice thin wafers directly. Hortech Co. is a high-quality Deep Ultraviolet Laser Machine with Large Power for Wafer-dicing, Ultrafast DUV laser machine for wafer-dicing & wafer grooving manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Deep Ultraviolet Laser Machine with Large Power for Wafer-dicing
Grooving the protective films or liquid of 18” wafers, or directly cutting through thin wafers
This laser machine employs DUV ultrashort pulses to remove the protective films or liquid of composites without damaging the silicon wafer at the bottom. It then performs plasma vertical wafer-dicing that results in smooth edges. It can also cut or dice thin wafers directly.
Several solutions are available to wafer-dicing, such as UV laser micro-cutting and infrared (IR) laser stealth dicing. If you demand high-quality thin wafers, reduced dust, or reduced thermal effects, you may order this machine to perform ultrafast deep ultraviolet laser micro-etching and micro-cutting. It can cut through thin wafers directly with excellent flat, smooth edges. It can perform wafer-dicing with protective films or liquid that results in minimum dust. It dust-free wafer-dicing is required, you may adopt the following process: (1) Coat the wafer with protective films or liquid, regardless of its thicknesses; (2) Employ the ultrafast DUV laser to micro-etch the protective films or liquid, or cut through the thin metal films without damaging the silicon layer; (3) The volume of the silicon layer that are micro-etched by the power of the plasma can be calculated. You may control how long this machine performs laser micro-etching to achieve the depth of semi-cut that you desire; (4) Finally, remove the protective films or liquid.
Applications
- Wafer dicing
- Wafer cutting
- Wafer plasma vertical cutting
- Wafer grooving
- Micro-etching on protective films or liquid
- Micro-cutting by micro-etching
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Deep Ultraviolet Laser Machine with Large Power for Wafer-dicing | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Deep Ultraviolet Laser Machine with Large Power for Wafer-dicing, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.