Laser Micro-cut Precision Spacers
Spacers for precision structure, precision gaskets
As the 5G high-speed communication industry develops, the demand for MEMS finishing high-speed optical fiber products increases. Among all, spacers are critical to the realization of high-speed data transmission. Along with the increasing demands for conversions from optics to electrics and optical alignment, the demand for precision components increases as well.
Hortech employs the advanced laser to perform precision finishing in different cases, including micro-drilled optical glass for optical fiber array alignment, laser optical precision alignment and fastening, and positioning plates, such as spacers. Hortech carries out customized finishing according to the client's request. The precision Hortech achieves is at the micron level. Precision laser finishing facilitates high-speed optical transmission and precise alignment of the assembly structure.
Laser Precision Micro-Cutting for Silicon Wafers
Many components of high-precision MEMS structure require cutting silicon wafers in unique shapes. Hortech employs cold laser and micro-electromechanical motion control to finish silicon materials to mass produce structural spacers.
Product Features
- The precision is at the micron or sub-micron level.
- High flexibility in finishing.
- MEMS process for silicon.
Applications
- Camera focus tuning.
- Spacer for the 5G communication structure.
- Precision calibration for machine tools.
Laser Micro-cut Precision Spacers | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-cut Precision Spacers, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.