Laser Micro-cutting System for Flexible Substrates | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
This laser micro-cutting system for flexible substrates is designed to cut flexible materials in curved shapes. It encompasses Hortech's patented technology that triggers lasers having equivalent energy to evenly arrive at the same location. This helps minimize thermal effects and increase the utility of organic materials. Hortech Co. is a high-quality Laser Micro-cutting System for Flexible Substrates, Curved micro-cutting that reduces thermal effects for functional, organic, flexible materials manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Laser Micro-cutting System for Flexible Substrates
Cutting organic materials in heterotypic shapes, cutting PI, cutting polarizer, cutting PET
This laser micro-cutting system for flexible substrates is designed to cut flexible materials in curved shapes. It encompasses Hortech's patented technology that triggers lasers having equivalent energy to evenly arrive at the same location. This helps minimize thermal effects and increase the utility of organic materials.
Various new ultracompact, miniaturized products require substrates made of flexible materials. Curved shapes are designed to enhance product appearance. Traditional stamping technique cannot cut flexible materials in curved shapes. As the pursuit for higher precision arises, laser micro-cutting, a cold finishing technique, is well suited to curve-cutting.
Cold Laser Micro-Cutting For Curved Flexible Materials
Cold laser micro-cutting is particularly suited to flexible, heat-sensitive materials. This system controls the laser in real-time in accordance with the motion trajectory to minimize thermal effects. Its design takes the following factors into consideration: laser parameter setup, wavelengths, process control optimization, motion control, dust removal in the surrounding, environmental control, and cooling. Taking the above into considerations helps come up with the best solution.
Product Features
- Cold laser finishing.
- Process optimization.
- Equivalent energy trigger at the same location.
Applications
- PI curve-cutting.
- PET curve-cutting.
- PMMA curve-cutting.
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Laser Micro-cutting System for Flexible Substrates | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-cutting System for Flexible Substrates, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.