How would the finishing impact the quality if the products/components/parts are made of composite materials that are both flexible and hard?
As wearables popularize, the adoption of flexible and hard circuit boards increases. Employing traditional die-cutting to cut hard boards can be fast. However, the quality is poor when it comes to cutting flexible boards. Laser micro-cutting can cope with composite boards that are both flexible and hard. It has the following advantages:
1. The client can freely design the circuit. Laser micro-cutting does not need molds, which saves the cost of creating new molds when the pattern is modified.
2. The efficiency of micro-cutting flexible boards by laser is extremely high. As well, the source power of the laser can be adjusted to cut hard boards, and the cutting quality is better.
3. Laser micro-cutting and laser micro-drilling will be the dominant processes in the future. They are particularly suited to miniaturized, ultracompact devices containing flexible boards.