Laser Micro-Drilling Machine for Mass Producing Flexible Boards | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
To cope with products made of ultracompact, flexible materials, Hortech launches the 2D laser micro-drilling machine. This allows for mass production of the above products because it can be used to finish PI, PET, epoxy, COP, and so on. Some substrates are made of insulating materials. The conductive components built on these substrates form the circuits. The quality of vias needs to be high. Thus, micro-drilling cannot produce dust and thermal effects. The precision of the vias must be high. The diameter of vias or blind holes needs to be small. The distance between these vias or blind holes needs to be small as well. Sometimes the above diameter and distance need to be at the micron level. Hortech Co. is a high-quality Laser Micro-Drilling Machine for Mass Producing Flexible Boards, This laser micro-drill machine produces a considerable amount of vias on ultra-compact flexible materials manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.
Laser Micro-Drilling Machine for Mass Producing Flexible Boards
Excimer laser machine with masking for project focuser
To cope with products made of ultracompact, flexible materials, Hortech launches the 2D laser micro-drilling machine. This allows for mass production of the above products because it can be used to finish PI, PET, epoxy, COP, and so on. Some substrates are made of insulating materials. The conductive components built on these substrates form the circuits. The quality of vias needs to be high. Thus, micro-drilling cannot produce dust and thermal effects. The precision of the vias must be high. The diameter of vias or blind holes needs to be small. The distance between these vias or blind holes needs to be small as well. Sometimes the above diameter and distance need to be at the micron level.
Semiconductors are developed for rapid mass production of ultracompact and miniaturized products. This requires a tremendous number of holes. Traditional finishing relies on scanning, which can be employed to produce irregular holes in a large area. In contrast, 2D masking finishing can be employed to mass produce many holes in smaller areas. This machine can achieve the above and cost-effectiveness.
The Cold Laser Process for a Huge Amount of Micron Holes
Advanced semiconductor packaging requires a large number of micron via holes, which can be created by Hortech's customized laser machine or standard mass production machine. This machine can satisfy the special needs of 3D advanced packaging. This machine has successfully produced holes at 5um. Hortech can design and develop customized laser machines according to the client's request.
Personal wearable electronics require ultracompact substrates with circuits. Flexible substrates with many micron vias can replace the traditional ones. This includes substrates for microprocessors. The demand for wearables grows rapidly as the population ages and metaverse arises. This requires high-quality finishing and flexible design. The laser machine Hortech develops can fulfill the ever-evolving demand.
Product Features
- Micron diameter and distance between holes.
- Sub-micron precision.
- Cost-effective mass production.
- Steady high yield.
- Excimer direct writing.
- Micro-drilling for 3D packaging.
- FPC micro-drilling for flexible boards.
Applications
- Vias for the advanced 3D packaging of semiconductors.
- Circuit substrates of wearable devices.
- Glass substrates.
- Flexible circuit boards.
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Laser Micro-Drilling Machine for Mass Producing Flexible Boards | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-Drilling Machine for Mass Producing Flexible Boards, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.