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Laser Micro-cutting Small Wafers | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

The surface of the wafer must be clean and dust-free after the larger one is cut, so it is crucial to prevent the dust or clean it during the process. Hortech has launched a patented upside-down laser machine that can perform dust removal by exploiting the gravity. It combines the laser protective film and the upside-down machine. High yields are guaranteed by optimal processes. Hortech Co. is a high-quality Laser Micro-cutting Small Wafers, The wafer in the traditional size is laser cut into smaller pieces as a minifab’s process requires. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

MiniFab wafer, wafer dicing, wafer cutting, wafer laser micro-cutting / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

The wafer in the traditional size is laser cut into smaller pieces as a minifab’s process requires. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Laser Micro-cutting Small Wafers - The wafer in the traditional size is laser cut into smaller pieces as a minifab’s process requires.
  • Laser Micro-cutting Small Wafers - The wafer in the traditional size is laser cut into smaller pieces as a minifab’s process requires.

Laser Micro-cutting Small Wafers

MiniFab wafer, wafer dicing, wafer cutting, wafer laser micro-cutting

The surface of the wafer must be clean and dust-free after the larger one is cut, so it is crucial to prevent the dust or clean it during the process. Hortech has launched a patented upside-down laser machine that can perform dust removal by exploiting the gravity. It combines the laser protective film and the upside-down machine. High yields are guaranteed by optimal processes.

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Traditionally, a rotary cutter was used for wafer cutting or dicing. It is simple and convenient, but it suffers from severe splashing, wide grooves, and stresses. Many factories have switched to laser solutions to wafer cutting. Laser micro-cutting not only diminishes splashing, but also produces narrower grooves. Hortech develops a patented upside-down laser machine that combines multi-layered focused cutting and scrap cutting for grooves at the surface. This machine is equipped with high power vacuuming that removes debris without damaging the surface. It helps effectively reduce the cost and simplify both the front and back end processes. It is applicable to LED wafer cutting, silicon wafer cutting, SiC wafer cutting, glass wafer cutting, and MEMS wafer cutting.

Wafer Laser Micro-Cutting

Cutting semiconductor wafers by laser technologies results in narrower grooves as well as reduced wear. Additionally, the stealth dicing solution adopted together can effectively address the dust problem. Hortech can respond to new MiniFabs' process demands by cutting wafer in a specific size and shape according to the process. The wafer in this case was cut into half -inch size.

Product Features
  • High flexibility in cutting size and pattern.
  • Optional dust-free laser cutting.
  • High cutting precision.
  • Can modify the process quickly.
Applications
  • MiniFab Wafer.
  • Si-based mechanical components.
  • Components related to wafer process related.

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Laser Micro-cutting Small Wafers | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-cutting Small Wafers, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.