Precision cut silicon carbide (SiC) wafer by the waterjet laser machine
Hortech performs laser cutting to cut the silicon carbide (SiC) wafer using its waterjet laser...
DetailsMicrotexturized/microstructurized silicon (Si) wafer by the waterjet laser machine
Hortech creates microtexture/microstructure on the silicon wafer by using its waterjet laser...
DetailsSilicon Wafer Dicing by the Waterjet Laser Machine
Hortech works with a Swiss manufacturer to launch the waterjet laser machine, which can perform...
DetailsSilicon carbide (SiC) Wafer Dicing
Hortech has developed the ultrafast laser machine that can implement SiC wafer dicing at high...
DetailsLaser Engraved Wafer ID
Hortech engraves SEMI font on wafers for semiconductor equipments to read and identify. This...
DetailsWafer Laser Micro-engraving
Before processing semiconductor wafers, it is necessary to precisely engrave the SEMI OCR fonts...
DetailsLaser Micro-cutting Small Wafers
The surface of the wafer must be clean and dust-free after the larger one is cut, so it is crucial...
DetailsLaser Heterotypic Cutting on Silicon Wafer (Hyterotypic Wafer Dicing)
Silicon wafers have been widely adopted, so many semiconductor-related industries prefer to use these...
DetailsLaser Micro-cutting Fingerprint IC Substrates
To cut fingerprint IC substrates, Hortech coats substrates with protective films to reduce...
DetailsSurface Micro-texturization of Copper Cooling Fins
The surface of copper cooling fins needs to be micro-texturized/micro-structured. Many metal...
DetailsLaser Micro-drilled Silicon Wafer
Material: Si, SiN, and other MEMS wafers. The hole diameter is smaller than 5 um.
DetailsLaser Micro-cut Precision Spacers
As the 5G high-speed communication industry develops, the demand for MEMS finishing high-speed...
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